Providing Today’s Leading Edge Engineers High Quality Flow Simulation Analyses  for Tomorrow’s Products

Accuracy

Speed

Quality

Attention to Details

Thorough Engineering

Timely Feedback

Copyright © All rights reserved. Made By Intrepid Plastics Solutions.

 

Fill/Packing Analysis

 (Without Cooling)

Fill/Packing Analysis with Warpage

(Without Cooling)

Utilizes the filling and packing phase results as input into a stress analysis to predict part warpage.  This analysis does not include the mold cooling circuit.  The analysis assumes constant mold temperature and ideal cooling efficiency therefore differential cooling effects on warpage are not considered.

 

Fill Analysis

Simulates the filling phase of the injection molding process. The simulation can incorporate regular, profiled or sequential injection.   

 

Fill/Packing Analysis

 (With Cooling)

Adds the cooling phase simulation incorporating the mold cooling circuit to evaluate the mold cooling efficiency.

 

Fill/Packing Analysis with Warpage

(With Cooling)

Utilizes the filling, packing  and cooling phase results as input into a stress analysis to predict the part warpage.  This analysis includes the mold cooling circuit to evaluate the mold cooling efficiency therefore differential cooling effects on warpage are considered.

 

C*Flow Analysis Options

Adds the packing phase simulation of the injection molding process.  The analysis can incorporated both regular and profiled packing.

 

Cooling Options
C*Flow Fill
C*Flow Fill/Pack
C*Flow Fill/Pack/With Cooling
C*Flow Fill/Pack/Warpage/With Cooling
C*Flow Fill/Pack/Warpage
Contact Us
Contact Us